P3067 IC Chip BGA Reballing Stencil Kits Set Solder Template

900

P3067 IC Chip BGA Reballing Stencil Kits Set Solder Template

P3067 IC Chip BGA Reballing Stencil Kits Set Phone 8 in Microsolution Hallroad Lahore

  • 100% brand new and high quality.
  • This is a set of different stencils mainly used for iPhone BGA reballing.
  • Made of premium metal material, these stencils are durable.
  • There are total 16 stencils that can be used for all models, including 4, 4S, 5, 5mini, 5S, 5C, 6, 6P, 6S, 6SP, 7, 7P, 8, 8P, SE, X.

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Description

P3067 IC Chip BGA Reballing Stencil Kits Set Solder Template Multi-Function CPU Tin Steel Net For I Phone 8 in Pakistan

 

  • BGA
  • I PHOE
  • i phone 8
  • IC Chip
  • IC Chip BGA
  • iphone
  • p3062
  • Reballing
  • Reballing Stencil Kits
  • Set Solder
  • solder set
  • template
  • tin steel

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