P3067 IC Chip BGA Reballing Stencil Kits Set Solder Template
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All MIcroSolution Pro, Consumer Electronics
P3067 IC Chip BGA Reballing Stencil Kits Set Solder Template
All MIcroSolution Pro, Consumer ElectronicsP3067 IC Chip BGA Reballing Stencil Kits Set Solder Template
P3067 IC Chip BGA Reballing Stencil Kits Set Phone 8 in Microsolution Hallroad Lahore
- 100% brand new and high quality.
- This is a set of different stencils mainly used for iPhone BGA reballing.
- Made of premium metal material, these stencils are durable.
- There are total 16 stencils that can be used for all models, including 4, 4S, 5, 5mini, 5S, 5C, 6, 6P, 6S, 6SP, 7, 7P, 8, 8P, SE, X.
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