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P3067 IC Chip BGA Reballing Stencil Kits Set Solder Template


P3067 IC Chip BGA Reballing Stencil Kits Set Phone 8 in Microsolution Hallroad Lahore

  • 100% brand new and high quality.
  • This is a set of different stencils mainly used for iPhone BGA reballing.
  • Made of premium metal material, these stencils are durable.
  • There are total 16 stencils that can be used for all models, including 4, 4S, 5, 5mini, 5S, 5C, 6, 6P, 6S, 6SP, 7, 7P, 8, 8P, SE, X.

900

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